MEC3H1SW
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| Flash Technology | 3D TLC |
| Capacity | 480GB ~ 3840GB |
| Interface | PCIe Gen4x4, NVMe |
| Storage Temperature | -55℃ ～ 95℃ |
| Seq. Performance Read (max.) | 7,200 MB/s (estimated) |
| Seq. Performance Write (max.) | 6,800 MB/s (estimated) |
| Random 4K Read (IOPS max.) | 1,000,000 (estimated) |
| Random 4K Write (IOPS max.) | 1,000,000 (estimated) |
| Power Requirement | DC 3.3V |
| Dimension (mm) | 80.0 x 22.0 x 3.6 |
| MTBF (est) | > 3,000,000 hrs |
| Operating Temp. (Standard) | SP**GIMEC3FSV0 (0~70℃) |
| Operating Temp. (Wide) | SP**GIMEC3FSW0 (-40~85℃) |
| Vibration | 15G, 10~2000Hz |
| Drop | 75cm |
| Shock | 1,500G@0.5ms |
| Power Shield | ● |
| End-to-End Data Protection | ● |
| TRIM | ● |
| S.M.A.R.T. | ● |
| DEVSLP | ● |
| SP SMART Utility | ● |
| External DRAM Buffer | ● |
- NGFF M.2 (M Key) standard form factor
- Compliant with NVMe Express 1.4
- Support Data Security with AES 256 Encryption (Optional)
- Support SP Toolbox SMART health monitoring software