Low-Profile SDRAM/DDR/DDR2/DDR3

Features
. Frequency:400Mhz,533Mhz, 667Mhz, 800Mhz . Programmable CAS Latency: 3,4,5,6
. 8 Banks
. 4-bit pre-fetch
. Posted CAS
. Burst Length: 4 , 8(Interleave/nibble sequential)
. Off-Chip Driver(OCD) Impedance Adjustment
. On Die Termination with selectable values
. Programmable Sequential / Interleave Burst Mode
. Average Refresh Period 7.8us
. FBGA Pb-Free package
. All of Lead-free products are compliant for RoHS
. PCB Dimension DIMM 18.24mm / SO-DIMM 25.54mm
. Storage Temperature -55°C ~ -+100°C
. Operating Temperature 0°C ~ + 85°C
Specifications
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Specifications
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